For Tensile/Shear Testing of Chip
For Tensile/Shear Testing of Chip List
For Tensile/ Shear Testing of Chip Components
Alignment Stage for Solder Joint Strength Test
SJS-100N-L/S
SJS-100N-L/S is alignment stage with 100N capacity for solder joint strength test of QFP lead (lead free solder) or IC chips. It allows easy and fine position adjustment of tiny parts. The stage angle is switchable to 45 or 90 degrees.
QFP Lead Hook/Chip Shear Jig
SJ series
SJ series is QFP lead hook/Chip shear jig with 100N capacity for solder joint strength test. 5 types are available to meet your testing requirements. It complies with the corresponding part of IEC and JIS standards.
Chip Peel Fixture
GT-10/20
GT-10/20 is chip peel fixture with 500N capacity. It is suitable for low capacity measurement in narrow space due to compact and light-weight design. It is ideal for peel (shear) testing of electric components.